iPhone 3.0 component breakdown – Who supplies what for third-gen iPhone

Only in a world where an intimate obsession with mobile phones is considered a job requirement do we find ourselves intrigued by handset component breakdowns. And, in that world, the iPhone reigns the hype-king. For instance, DigiTimes has just posted a breakdown of component suppliers for the upcoming third-generation iPhone – the iPhone 3.o, as it were – and we couldn’t help but give it a once-over.

DigiTimes has gathered data on component suppliers through “industry sources” that we’re going to presume are legitimate. The data shows that Samsung and Toshiba (OTCPK: TOSBF) will be the iPhone 3.0’s NAND memory suppliers, although we expect Samsung is picking up the bulk of the orders. Like the current-generation iPhone 3G, the upcoming iPhone 3.0 will sport a baseband and GPS radio sourced from Infineon (NYSE: IFX). Bluetooth will be provided by CSR, perhaps even with low-power support.

The component breakdown also confirms that at least one of the two new upcoming iPhones will sport a 3.2-megapixel camera, sourced from OmniVision.

Now, all we have to do is wait for mid-June to roll around…

[Via: DigiTimes]