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Texas Instruments announces OMAP 4470 1.8 Ghz dual-core processor

June 2, 2011 by Simon Sage - Leave a Comment

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Today at the Computex conference, Texas Instruments announced a new dual-core processor that can run as fast as 1.8 GHz. The OMAP 4470, like its 4460 and 4430 predecessors, is built with two ARM Cortex-A9 processors and 45 nm semiconductor technology, however the Powervr SGX544 graphics are 2.5 times better than what’s offered on the OMAP 4430. The new chip can handle up to three screens at once over HDMI (with stereoscopic 3D if you’re into that kind of thing), at a maximum resolution of 2048 x 1536. The processor also has a dedicated 2D graphics core, making it ideal for handling those complex layered user interfaces we love so much. TI claims the chip is robust enough to handle desktop-grade apps while remaining power efficient enough for smartphones and tablets, which is a bold and exciting possibility.

So which devices will use this fancy new chip? Android is a given, but Texas Instruments confirms that Windows 8 will be making use of it as well. Samples will be heading out in the second half of 2011 to manufacturer partners, with devices proper landing in the first half of 2012. Considering RIM’s deep involvement with TI with the BlackBerry PlayBook, it wouldn’t be surprising to have the sequel running this new chip, or maybe see it in some of their first multi-core smartphones. As for Android, it’s been said that the Ice Cream Sandwich build will be optimized for Texas Instruments chips, and I would say that makes the OMAP 4470 a likely choice for the next Nexus device. Of course, we’re still waiting to hear more about OMAP 5, which clocks in at 2 GHz, excels in 3D graphics, and uses about 60% less power for the same tasks as OMAP 4 processors thanks to the 28nm production process.

One way or another, new processors with more horsepower and less power consumption is always good news for us mobile enthusiasts. We’ll keep our eyes peeled for devices early next year that take advantage of the OMAP 4470.

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