We’ve seen more than a few leaks of the greatly anticipated HTC M7, and today ETradeSupply has given us another leak of HTC’s flagship smartphone for 2013. We now have pictures of the chassis of the device, basically the shell of the phone itself that will house all of the smartphone parts such as the display, camera, and motherboard.
The chassis can house up to a 4.7 inch display, which is rumored to have a 1920×1080 resolution, making a pixel density of 469 ppi. The HTC M7 is also rumored to have a 1.7GHz quad-core Snapdragon S4 Pro, 2GB of RAM, 32GB of internal storage, and a 13 megapixel camera. The chassis, which looks almost identical to the HTC 8X, sports a matte finish back plate and smooth, angular sides that taper towards the back of the phone. On the backplate can be found the embossed HTC logo as well as a Beats Audio logo closer to the bottom. It seems to be lacking a rubber gasket like that of the Droid DNA, so be careful while you’re taking selfies in the restroom.
It’s been rumored that this device won’t be popping up at MWC this year, but rather at an earlier HTC press event in London and New York. Only time will tell, but there’s no doubt that HTC won’t want to wait too long to unveil their new flagship handset.
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