Toshiba will be releasing the thinnest 13 MP camera sensor ever manufactured. At just 4.7mm thick, the unit is designed to fit snugly into future smartphones and tablets. Toshiba is expected to start shipping samples of the module to manufacturers in early May, and we could see the camera module make its way into tablets and smartphones in the 2013 holiday season.
To make a camera module this thin, Toshiba utilizes a dedicated signal processing circuit coupled with four plastic lenses. The Toshiba also utilized a flip-chip structure instead of a traditional wire bonded structure.
Currently, the sensor modules are expected to carry a price tag of $74, with Toshiba expecting to be producing one million of the modules a month by the year’s end. The modules will no doubt make their way into a variety of devices, and could end up in some high-end devices.
[Via: Unwired View]
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