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MobileTechNews reports that Tessera Technologies has announced their new thin-wafer technology that promises to make digital camera lenses super-thin. The breakthrough technology, dubbed OptiML WLC, will undoubtedly see applications in cameraphones – pushing the boundaries of miniaturization for digital camera components. Tessera claims to be able to manufacture the components at the wafer-level – sandwiching thousands of incredibly thin wafers and bonding them at the wafer level (with WaferStack technology); and will still be able to auto-focus while saving 30% in production costs and shaving 50% off the overall size of the module.
We can’t wait to see these super-small camera modules implemented into the latest cameraphones! And with the cost savings of OptiML WLC, we expect all manner of mobile phones to start including cameras. The day of the cameraphone has arrived!
[Via: PhoneScoop]
About The Author
Will Park
Will hails from The City of Angels - Los Angeles, California. He spends his time playing with his numerous gadgets and looking forward to seeing what future holds for mobile technology. An avid promoter of a fully "digital" life, he promotes the widespread adoption of truly mobile, paper-less living. He dreams of the day when he can go completely digital. No more snail mail, paper receipts, bound books, notepads/spiral notebooks, credit cards, hard currency. He's a digital warrior - fighting for the converged life. He is an idealist and a realist - he has a perfect view of what the world should be but knows that the world is not perfect. Can we ever hope to see Will's dream become reality? We'll see...
