iPhone 3G component breakdown – who supplies what

The global launch date for the iPhone 3G is getting closer and closer, and today we have some insight in to what could be a component supplier breakdown for the iPhone 3G.

Chinese-language tech-rag Commercial Times is reporting that the iPhone 3G will be integrated by Foxconn (Hon Hai), not Quanta, as earlier reports had indicated.

And, as expected, Infineon (NYSE: IFX) has allegedly been confirmed as the component supplier for the iPhone’s cellular chipset – digital baseband controller, power management unit (PMU), and radio frequency (RF) module. Broadcom (NSDQ: BRCM) has been tapped as the GPS hardware supplier.

The chart below details the rest of the iPhone 3G’s component breakdown.

 

Sharp will be providing the multi-touch panel. It seems that Apple (NSDQ: AAPL) was impressed with Sharp’s new multi-touch panel enough to snuff Balda for the new batch of iPhones. All those dead-strips that we’re still seeing on first-generation iPhones will hopefully be a non-issue for the iPhone 3G’s Sharp-sourced touch-panel.

[Via: DigiTimes]