Only in a world where an intimate obsession with mobile phones is considered a job requirement do we find ourselves intrigued by handset component breakdowns. And, in that world, the iPhone reigns the hype-king. For instance, DigiTimes has just posted a breakdown of component suppliers for the upcoming third-generation iPhone – the iPhone 3.o, as it were – and we couldn’t help but give it a once-over.
DigiTimes has gathered data on component suppliers through “industry sources” that we’re going to presume are legitimate. The data shows that Samsung and Toshiba will be the iPhone 3.0’s NAND memory suppliers, although we expect Samsung is picking up the bulk of the orders. Like the current-generation iPhone 3G, the upcoming iPhone 3.0 will sport a baseband and GPS radio sourced from Infineon. Bluetooth will be provided by CSR, perhaps even with low-power support.
The component breakdown also confirms that at least one of the two new upcoming iPhones will sport a 3.2-megapixel camera, sourced from OmniVision.
Now, all we have to do is wait for mid-June to roll around…
[Via: DigiTimes]