The global launch date for the iPhone 3G is getting closer and closer, and today we have some insight in to what could be a component supplier breakdown for the iPhone 3G.
Chinese-language tech-rag Commercial Times is reporting that the iPhone 3G will be integrated by Foxconn (Hon Hai), not Quanta, as earlier reports had indicated.
And, as expected, Infineon has allegedly been confirmed as the component supplier for the iPhone’s cellular chipset – digital baseband controller, power management unit (PMU), and radio frequency (RF) module. Broadcom has been tapped as the GPS hardware supplier.
The chart below details the rest of the iPhone 3G’s component breakdown.
Sharp will be providing the multi-touch panel. It seems that Apple was impressed with Sharp’s new multi-touch panel enough to snuff Balda for the new batch of iPhones. All those dead-strips that we’re still seeing on first-generation iPhones will hopefully be a non-issue for the iPhone 3G’s Sharp-sourced touch-panel.