Holiday Gift Guide »

Acer Liquid Metal Supports 14.4Mbps HSPA, New Snapdragon Chipset

Categories: Acer, Android
By: , IntoMobile
Friday, October 29th, 2010 at 8:46 AM

Acer is rocking the smartphone space with its Liquid Metal, which supports 14.4Mbps HSPA 3G for super fast data where it’s available. Additionally, the new Acer Liquid Metal features the latest Snapdragon MSM7230 chipset that sits in the T-Mobile G2 and HTC Desire Z. As we’ve seen in tests, the 800MHz processor might not look as good on paper as the 1GHz CPUs we find in other smartphones, but it is equally capable.

The Liquid Metal runs Android 2.2, but will be coming skinned with Acer’s Breeze interface. Breeze adds some social networking and weather widgets amongst other things to give a little distinct taste to vanilla Android if you’re looking for a bit more than just the bare-bones OS. But the build quality of the phone is different, too, as Electronista reports:

The phone earns its name through improved build quality, which replaces the almost all-plastic body of the Liquid E with a steel back cover and chrome trim. A relatively uncommon “rounded” 3.6-inch, 800×480 screen also sets off the design. It marks an overall functional upgrade as well with a five-megapixel camera that can record 720p videos, a Dolby Surround boost to audio and DLNA media sharing.

Looks like this could be a decent handset for Acer. For now, it looks like this thing is headed to the UK only for £299 ($476), but that could change depending on how well it does there. It would be nice to see it mix things up in the North American markets, too.

[Via: Electronista]

About The Author

Marc Flores

Marc has been a mobile fanatic for the better part of a decade and has had more devices pass through his hands than he would care to count. Originally from Los Angeles and briefly in San Francisco, Marc now lives in Brooklyn where, unlike Will Park, he longs for simpler times and simpler technology. All the while, he writes about gadgets and wireless technology as he tinkers, hacks and ultimately breaks most of his gadgets in the process. Marc has written about the mobile industry for Boy Genius Report, MobileCrunch, Laptop Magazine and has had his work appear in the Wall Street Journal, Gizmodo, CrunchGear and more.