MediaTek has announced its latest Dimensity 7450 and Dimensity 7450X processors, expanding its mid-range chipset lineup with incremental but meaningful improvements. The new octa-core processors succeed last year’s Dimensity 7400 series and maintain the dual-variant approach, with the 7450X specifically designed for flip-style foldable smartphones that require dual display support.
This launch comes as smartphone manufacturers increasingly focus on delivering flagship-level features in more affordable devices. The mid-range processor segment has become particularly competitive as consumers demand better performance, camera capabilities, and 5G connectivity without premium pricing. MediaTek’s consistent updates to its 7000 series help maintain its position against Qualcomm’s Snapdragon alternatives in this crucial market segment.
The Dimensity 7450 processors maintain the same core architecture as their predecessors, featuring four Arm Cortex-A78 performance cores running at up to 2.6 GHz alongside four Arm Cortex-A55 efficiency cores. While the CPU configuration remains unchanged, MediaTek has focused improvements on AI processing and connectivity capabilities.
The company claims AI performance has increased by up to 7% for AI-specific tasks, with particular benefits for computational photography features that have become essential for smartphone camera systems. This improvement is powered by MediaTek’s 6th generation NPU (Neural Processing Unit), which handles machine learning tasks more efficiently than the previous generation.
One of the most significant upgrades comes in 5G connectivity. The new processors include an upgraded modem that supports 3GPP Release 17 standards, compared to the Release 16 modem in the Dimensity 7400. This updated modem brings several practical improvements:
- Peak 5G downlink speeds of up to 3.27Gbps using 3CC carrier aggregation with 140MHz spectrum
- Up to 20% better power efficiency in typical Sub-6GHz usage scenarios through MediaTek 5G UltraSave 3.0+ technology
- Second-generation high-speed rail mode with 20% better performance during transit
- Improved network recovery when moving out of dead zones
The processors also support comprehensive connectivity options including tri-band Wi-Fi 6E with 2T2R antenna configuration and Bluetooth 5.4. MediaTek’s Network Observation System helps predict network conditions to enable smooth switching between 5G and Wi-Fi connections.
For camera capabilities, both processors can handle up to 200MP main sensors through the Imagiq 950 ISP with 12-bit HDR support. Video recording reaches 4K at 30fps with HDR and electronic image stabilization. Display support includes WFHD+ at 120Hz refresh rates or Full HD+ at 144Hz, covering most current smartphone display configurations.
The processors are manufactured on a 4nm-class process and support LPDDR5 memory at speeds up to 6400Mbps, along with UFS 3.1 storage connectivity. Location services cover all major satellite navigation systems including GPS, BeiDou, Glonass, Galileo, QZSS, and NavIC.
MediaTek expects the first smartphones powered by Dimensity 7450 and 7450X processors to launch in the coming months. The timing aligns with the typical smartphone development cycle, suggesting these chips will likely appear in devices launching in the second half of 2024 and into 2025.