If you have a thing for seeing tech and gadgets stripped to bits and torn right down to the transceiver, you’ll enjoy this tear down of the Samsung Galaxy S. Apparently, the Galaxy S i9000 is pretty well built, but far easier to take apart than the Omnia, also by Samsung. So what exactly does this tear down reveal that we didn’t already know?
For those of you so technically inclined and curious, I’ll let phoneWreck do the explaining:
At the centre of the diagram, the Samsung “Hummingbird” S5PC110A01 applications core reins supreme. There’s been plenty of debate that this is the die hiding underneath Apple’s A4 skin – it’s hard to say. One thing for certain, this device kicks arse. Capable of assembling ~90 million triangles/second, penetration of this processor will only make smartphone gaming a more immersive experience.
Similar to the iPhone, Samsung chose an Infineon baseband. The YYN1N7438A8 to be exact. The baseband wasn’t infineon’s only win, coming in with the PMB 5703 SMARTi UE transceiver as well.
Not surprisingly, Samsung has kept things consistent with just about every other phone and provided itself with the memory wins. The K4X1G323B, KLM8G4DEDD and K4X2G323PB represnt the 1Gb DDR SDRAM, 8Gb Managed NAND and 2Gb DDR SDRAM respectively.
Communications are literally monopolized by Triquint. We’ve got a duplexer (TQM6M26028L) a transmit module (TQM69014), and two power-amps TQM676021 and TQM666022.
Wi-Fi and Bluetooth communications are handled by the same MCP/combo device that we found on the iPhone 4, the Broadcomm BCM4329FKUBG. Broadcomm also has the GPS win with the BCM4751.
Audio Codec goes to Wolfson (WM8994E), Camera Controller to NEC (MC-10170), Touch Screen Controller to Atmel (MX1224) and PMIC to Maxim with the MAX8998.
Now you can rest easy knowing exactly what’s lurking underneath all that plastic, glass and metal you’re carrying around in your pockets.
[Via: phoneWreck]