MobileTechNews reports that Tessera Technologies has announced their new thin-wafer technology that promises to make digital camera lenses super-thin. The breakthrough technology, dubbed OptiML WLC, will undoubtedly see applications in cameraphones – pushing the boundaries of miniaturization for digital camera components. Tessera claims to be able to manufacture the components at the wafer-level – sandwiching thousands of incredibly thin wafers and bonding them at the wafer level (with WaferStack technology); and will still be able to auto-focus while saving 30% in production costs and shaving 50% off the overall size of the module.
We can’t wait to see these super-small camera modules implemented into the latest cameraphones! And with the cost savings of OptiML WLC, we expect all manner of mobile phones to start including cameras. The day of the cameraphone has arrived!
[Via: PhoneScoop]