Qualcomm is full of news at this year’s Mobile World Congress. There are three important announcements the American company has releases. Let’s quickly go through each one of them.
- First the company’s subsidiary Qualcomm MEMS Technologies along with Inventec unveiled the design specifications of the first smartphone to feature Qualcomm’s mirasol display – the Inventec V112. The device in question comes with a 1.1″ bichrome mirasol display as a secondary screen below the main display. The idea is to save power by redirecting display content from the primary display to the low-power mirasol screen, which can show such information as incoming calls, missed calls, email and SMS alerts, MP3 song titles and track ID information. The V112 includes a touchscreen covering the mirasol display, enabling users to navigate on the main display with the secondary one. Full press release is here.
- On the similar note, LG announced that it will begin the development of mirasol-enabled handsets. (release)
- Then, we’ve learned that Sony will use Qualcomm’s GOBI mobile internet technology in its VAIO notebooks. Initially, the VAIO Z, TT and new, ultra-cool P series will be the first GOBI-enabled computers, providing users with mobile broadband access and GPS functionality. Having those two on your laptop can’t harm anyone. (release)
- Qualcomm also introduced the “industry’s first” chipset solution for smartphones supporting CDMA2000 1xEV-DO Rev. B and Simultaneous Voice-Data Operation (SV-DO), as well as multi-carrier HSPA+ and LTE. The Mobile Station Modem MSM8960 chipset is the complete integrated solution that supports all of the world’s leading mobile broadband standards. It’s compatible with smartphone platforms based on Qualcomm’s other MSM8x60 chipsets, hence delivering significant economies of scale to device manufacturers. The MSM8960 is scheduled to sample in mid-2010. (release)
- Finally, Qualcomm announced that it has added 3G femtocell chipsets to its product roadmap. The company will be offering Femtocell Station Modem chipsets that will be the industry’s first to utilize the broadband speeds of 3GPP HSPA+, in addition to utilizing CDMA2000, including 1X and EV-DO Rev. A and Rev. B. The chipsets will include baseband functions, network listen and integrated RF capabilities for all major wireless bands, as well as innovative techniques addressing the issue of interference between femtocells and the macro network. This, however, won’t happen anytime soon as the sampling is scheduled for Q2 2010. (release)
That’s about all the Qualcomm news that could be of interest to our readers. Moving on…